Supermicro X11DPG-OT-CPU-P Motherboard Proprietary Dual Socket LGA-3647 (Socket P) Intel Xeon Scalable Processors Including 2nd Generation Models
| Applicability | AI / ML — server platform / infrastructure |
|---|---|
| Manufacturer | Supermicro |
| SKU | X11DPG-OT-CPU-P |
| Product Type | Embedded Server Motherboard |
The X11DPG-OT-CPU motherboard supports dual Intel Xeon Scalable-SP and 2nd Generation Intel Xeon Scalable-SP (Socket P) processors that offer 3 UPIs (Ultra Path Interconnect) support with a speed of up to 10.4 GT/s. With the C622 chipset built-in, this motherboard supports up to 6TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 ECC 2933/2666/2400/2133 MHz memory in 24 slots. This motherboard provides maximum performance, system cooling, and I/O expendability. It also supports up to 9TB memory with DCPMM modules installed. This motherboard is optimized for High-Performance Computing (HPC), deep learning, or artificial intelligence platforms.
Key Features
Intel C622
4 PCI-E 3.0 x24 slots to PCI-E board
M.2 Interface: 1 PCI-E 3.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-Key
2 PCI-E 3.0 NVMe x4 Internal Port(s)
1 VGA port
Intel C622 controller for 8 SATA3 (6 Gbps) ports, RAID 0,1,5,10
Dual LAN with 10Gbase-T from C622
2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors, Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz, Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots up to 6TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake only)
| Applicability | AI / ML — server platform / infrastructure |
|---|---|
| Manufacturer | Supermicro |
| SKU | X11DPG-OT-CPU-P |
| Product Type | Embedded Server Motherboard |